| Management number | 220801242 | Release Date | 2026/05/03 | List Price | $22.00 | Model Number | 220801242 | ||
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| Category | |||||||||
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. Read more
| XRay | Not Enabled |
|---|---|
| ISBN13 | 978-3031861024 |
| Language | English |
| File size | 15.9 MB |
| Page Flip | Enabled |
| Publisher | Springer |
| Word Wise | Not Enabled |
| Print length | 202 pages |
| Accessibility | Learn more |
| Screen Reader | Supported |
| Publication date | April 22, 2025 |
| Enhanced typesetting | Enabled |
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