CU31-2030 One-Component Capillary Underfill

★★★★★ 4.6 48 reviews

$90.00
Price when purchased online
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$90.00
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Free shipping Free 30-day returns

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Product details

Management number 211006868 Release Date 2026/04/04 List Price $36.00 Model Number 211006868
Category

ALPHA HiTech CU31-2030 is a single-component capillary underfill, designed to safeguard assembled chip packages on printed circuit boards. It boasts low viscosity, ensuring swift and efficient flow. Moreover, it features a high Tg and low modulus, leading to superior reliability. This product is ideal for assembling BGA, CSP, and Flip Chip devices.

  • Low Viscosity: Enables Fast Flow
  • Flows at Room Temperature
  • High Glass Transition Temperature
  • Low Elastic Modulus
  • Can Be Reworked
  • Ensures Excellent Reliability
  • Halogen-Free, Compliant with RoHS Directive
Brand Name ALPHA HiTech
Manufacturer ALPHA HiTech
Cooling Method forced air
Compatible Devices Desktop, Laptop
Power Connector Type 3-Pin or 4-Pin

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4.6 out of 5
★★★★★
48 ratings | 20 reviews
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